Our PROFIVE® brand single board computers are not only available in the OEM/ODM and easy to integrate versions, but also with integrated active or passive cooling solution (depending on the variant).

The advantage: These boards can be integrated and used immediately.


open-frame cooling solution

Size: only approx. 139 mm x 86 mm x 110 mm (width x height x depth)
Weight: approx. 890 g + options
A lid is available as an optional accessory.

active cooling solution

Size: only approx. 113 mm x 46 mm x 109 mm (width x height x depth)
Weight: approx. 330 g + options

The ready to use variants are available with the following single boards:


active cooling solution

Aktive Kühlung
Aktive Kühlung

up to 3.5 GHz | Bis zu 4 cores, 4 threads | TDP max. 25 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded R2312G / R2314G
  • Integrated GPU: AMD Radeon™
  • Up to 2x 16 GB dual channel DDR4 memory
  • Gigabit Ethernet: 2 Intel® I226 2.5 Gigabit with IEEE1588
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA each)
  • 1x rear USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA)
  • 1x internal USB 3.1 Gen2 (10 Gb/s, fused to = 900 mA)
  • 1x RS-232 (HDX/FDX) + 1 RS-232/485 (HDX/FDX)
  • 2x mini-DP++ connectors up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 Support (Infineon SLB 9670)

     
Downloads

data sheet on request


Aktive Kühlung
Aktive Kühlung

up to 4.15 GHz | 8 cores, 16 threads | TDP max. 25 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V2516 / V2718
  • Integrated GPU: AMD Radeon™
  • Up to 2x 32 GB dual channel DDR4 memory
  • Gigabit Ethernet: 2 Intel® I225 / 2.5 Gigabit
  • 2x USB 3.1 Gen2 (10 Gb/s, OCP = 900 mA each)
  • 1x USB-C 3.1 Gen2 (10 Gb/s, OCP = 1500 mA)
  • 1x eDP port with max. 3840 x 2160 incl. backlight control (OEM/ODM option)
  • 2x Mini-DP++ sockets, resolution up to 4096 x 2160 @ 60 Hz
  • 2x RS-232/485 ports (HDX/FDX)
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 Support (Infineon SLB 9670)
Aktive Kühlung
Aktive Kühlung

up to 5.1 GHz | 8 cores, 16 threads | TDP max. 45 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded - 8845HS / 8645HS / 8840U / 8640U
            AMD Ryzen™ 3 - 8440U
            AMD Ryzen™ 5 PRO - 8540U
  • Integrated GPU: AMD RDNA3 Radeon™ Graphics & XDNA Neural Processing Unit for AI Inferencing
  • 2x 32 GB Dual Channel DDR5-5600 SO-DIMM memory with ECC support (excluding 8440U)
  • Gigabit-Ethernet: 2x Intel® I226-V / 2.5 Gigabit
  • 2x USB 3.2 Gen2 (10 Gb/s, OCP = 1500 mA each)
  • 2x USB4 Gen3x2 or ALT-Mode support (40 Gb/s, OCP = 3000 mA)
  • Serial Port: RS-232/485
  • DP connector: 2x Mini-DP++ connectors, up to 3840 x 2160 @ 60 Hz
  • OCuLink x4 connector, PCIe Gen4 x4 interface
  • fTPM - AMD firmware Trusted Platform Module, TPM 2.0 support (Infineon SLB 9670)


open-frame cooling solution

up to 4.25 GHz | 8 cores, 16 threads | TDP max. 54 W supported

Keyfeatures

  • CPU: AMD Ryzen™ Embedded V2546 / V2748
  • integrated GPU: AMD Radeon™ graphics
  • Up to 2x 32 GB dual channel DDR4 memory
  • 2x Intel® I225 with IEEE1588 / 2.5 Gigabit Ethernet ports
  • TSN support / Wake-on-LAN supported by one port
  • 3x M.2 - Type B, Type E, Type M
  • 2x SATA (6G) with separate power connector
  • 1x Dual USB 3.1 Gen2 (10 Gb/s, OCP: 900 mA each)
  • 1x USB-C 3.1 Gen2 (10 Gb/s, OCP: 1500 mA)
  • 2x internal USB 2.0 (OCP: 900 mA each)
  • 2x Mini-DP++ connectors, resolution up to 4096 x 2160 @ 60 Hz
  • fTPM - AMD firmware Trusted Platform Module | TPM 2.0 support (Infineon SLB 9670)